Bond Website Update
Media Center Today ....Tech Fair Tues.
February 27, 2014
Our Lee bond technology committee met this week for further discussion in preparation for next Tuesday’s technology fair. Everyone is very excited about the technology fair scheduled for March 4th . We are expecting over ten vendors to bring in the newest school technology so we can try it out and assess what features would most enhance our curriculum. Teachers are scheduled to rotate throughout the day, as part of our professional development day, try out the equipment and make notes and complete evaluations.
Our architect, Dale Jerome and his team went through our buildings in detail last Friday, February 21st when we did not have school due to ice. They were inspecting details to refine their architectural drawings that are expected to go out for bid in March. Mr. Jerome shared a power point overview of the draft at the board meeting. Science teachers Mr. Lashbrook, Mr. Schleder and Mrs. Volpe were also present to thank the community for the passage of the bond and share information about the schools they have visited, their research, and department discussions in assisting with the planning of the new high school facilities and the middle school renovation. All of the science teachers have been contributing to the planning and students and staff are eager to make the move.
Our track committee reviewed of the track drawings with the architect and consultant. They are nearly ready for bid. We will be bidding a couple surface finishes to see where the numbers fall in development of the recommendation.